The **ATS-05B-102-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 5.24 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The design of this part focuses on maximizing surface area while ensuring secure mechanical attachment to a Printed Circuit Board (PCB). * **Heat Sink Profile:** It utilizes a straight-fin design. These are optimized for **forced air convection** (where a fan is present) rather than natural convection. * **Material:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The **Blue Anodized** finish isn't just for aesthetics; it provides corrosion resistance and increased emissivity for better radiant heat transfer. * **Push-Pin Attachment:** Instead of messy adhesives or heavy brackets, this part uses a spring-loaded push-pin system. This provides consistent pressure (approx. 20 psi) against the chip, ensuring the thermal interface material fills all microscopic gaps. --- ### 3. Thermal Performance Indicators Thermal resistance indicates how effectively the part moves heat away from the component. The lower the number, the better the cooling. 1. **Low Airflow (200 LFM):** ~5.24 °C/W 2. **Medium Airflow (400 LFM):** ~3.20 °C/W 3. **High Airflow (600 LFM):** ~2.51 °C/W --- ### 4. Key Electronic Applications This part is commonly found in the following industrial and consumer electronics: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Industrial PCs and automation controllers where space is limited but heat dissipation is critical.