The **ATS-05B-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "Blue" line of push-pin heat sinks designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Part Number** | ATS-05B-141-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Mounting Style** | Push-Pin (2-Pin) | | **Thermal Resistance** | 15.70°C/W (Unducted Flow @ 100 LFM) | | **Attachment Type** | Push-pin with Brass Compression Spring | --- ### Key Components & Design Features #### 1. Heat Sink Body (Fin Design) The device uses a **straight-fin** geometry. This design is optimized for environments where airflow is directed through the fins. The aluminum construction provides a balance between high thermal conductivity and low weight. #### 2. Mounting Mechanism: Push-Pin & Spring Instead of using messy thermal adhesives or complex brackets, this part uses: * **Push-pins:** Plastic pins that snap into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These ensure constant downward pressure between the heat sink and the component, maximizing thermal transfer efficiency and preventing the unit from shifting during vibration. #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes with **pre-applied T766 Phase Change Material**. This simplifies the assembly process: * The material is solid at room temperature for easy handling. * It flows into microscopic gaps when the component heats up, ensuring the lowest possible thermal resistance. --- ### Thermal Performance Overview | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.70 | | 200 (1.0 m/s) | 9.50 | | 400 (2.0 m/s) | 7.10 | | 600 (3.0 m/s) | 6.10 | --- ### Use Cases in Electronics * **Integrated Circuits (ICs):** Cooling microprocessors or power management units. * **FPGA & ASICs:** Used in networking and industrial equipment where high heat density is common. * **Embedded Systems:** Ideal for compact builds where a low profile (10mm height) is required.