The **ATS-05B-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications The model number provides specific details about its dimensions, material, and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.90°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Base Type** | Square | --- ### 2. Physical Design and Construction #### **Material and Coating** The heat sink is made from **extruded aluminum**, which offers a balance of lightweight properties and high thermal conductivity. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection against corrosion and slightly improves thermal emissivity. #### **Attachment System: pushPIN™** The "C2" in the part number indicates the attachment mechanism. It uses a **pushPIN™ system** which includes: * A pre-drilled hole pattern for the PCB. * A compression spring to provide a precise amount of pressure (Force) on the component. * A flexible attachment that ensures the heat sink stays flush with the chip even under vibration or mechanical shock. --- ### 3. Thermal Performance Indicators The efficiency of this part is measured by its **Thermal Resistance**, which determines how effectively it moves heat away from the silicon die. * **Low Airflow (200 LFM):** ~1.90°C/W. * **High Airflow (700 LFM):** ~1.20°C/W. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad or grease that fills microscopic air gaps between the chip and the heat sink base. --- ### 4. Typical Applications Due to its compact 30mm footprint, this part is commonly used for: 1. **Network Switches & Routers:** Cooling internal ASICs. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Cooling MOSFETs or power regulators.