The **ATS-05B-147-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The model number provides specific details about the dimensions, thermal resistance, and material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance (Unducted Flow)** | 13.52 °C/W @ 100 LFM | | **Fin Style** | Straight Fin | --- ### 2. Physical Design and Construction * **Low Profile:** With a height of only 10mm, this heat sink is ideal for space-constrained applications like 1U servers, network switches, or small-form-factor industrial PCs. * **Straight Fin Pattern:** The fins are aligned in a straight pattern, which is optimized for **forced air cooling** (where a fan blows air directly across the fins). * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodization increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 3. The pushPIN™ Mounting System One of the defining features of this part is the **pushPIN™** attachment mechanism: 1. **Spring-Loaded:** It uses a brass or plastic push pin with a high-performance compression spring. 2. **Consistent Pressure:** The spring ensures uniform pressure across the thermal interface material (TIM), maximizing heat transfer between the chip and the heat sink. 3. **Pre-Assembled:** It usually comes with the pins and springs pre-assembled, along with a pre-applied Thermal Interface Material (often a high-performance phase-change material). --- ### 4. Thermal Performance Comparison Thermal resistance ($\text{°C/W}$) indicates how many degrees Celsius the component will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.52 | | 300 (1.5 m/s) | 6.43 | | 500 (2.5 m/s) | 4.73 | *Note: Higher airflow (LFM) significantly reduces thermal resistance, making the part much more effective.* ---