The **ATS-05B-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 7.44°C/W (at 100 LFM) | | **Dimensions** | 50.00mm x 50.00mm | | **Height** | 25.00mm | --- ### 2. Key Component Features #### A. Thermal Performance The heat sink is designed for optimal airflow. The "C2" in the part number indicates a specific thermal profile. As airflow (LFM - Linear Feet per Minute) increases, the thermal resistance drops significantly, allowing the component to handle higher power loads. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes or simple clips, the **pushPIN™** system uses a spring-loaded pin. This provides: * **Constant Pressure:** Ensures a firm interface between the heat sink and the component for better heat transfer. * **Vibration Resistance:** Securely holds the part in place during shipping or operation in industrial environments. * **Pre-drilled Holes:** Requires specific hole patterns on the PCB (typically 43.00mm pitch for this model). #### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** Not just aesthetic; the anodization protects the aluminum from corrosion and slightly increases emissivity for better radiant cooling. --- ### 3. Dimensional Layout | Dimension | Value (mm) | | :--- | :--- | | **Width (A)** | 50.00 | | **Length (B)** | 50.00 | | **Height (C)** | 25.00 | | **Hole Pitch (E)** | 43.00 | | **Hole Pitch (F)** | 43.00 | --- ### 4. Implementation Requirements To use this part in an electronic design, you need: 1. **TIM (Thermal Interface Material):** Usually pre-applied (standard is T766 phase change material or similar). 2. **PCB Hole Pattern:** Two or four holes (depending on the specific pin configuration) must be drilled into the PCB at a 43mm spacing. 3. **Clearance:** A 25mm vertical clearance above the chip to accommodate the fins.