The **ATS-05B-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed specifically for cooling electronic components like CPUs, GPUs, and power modules that require efficient heat dissipation in a compact form factor. --- ### 1. Technical Specifications The part number defines the physical and thermal characteristics of the device. | Property | Description | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Fine-pitch (Cross-cut) | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components ### A. pushPIN™ Attachment System Instead of using messy adhesives or weak clips, this model uses a **pushPIN™** mechanism. * **Components:** Brass or plastic pins and stainless steel springs. * **Benefit:** Provides consistent pressure on the component, ensuring maximum heat transfer and vibration resistance. ### B. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. * This is a "Phase Change" or high-conductivity grease that fills microscopic air gaps between the chip and the heat sink base. * It ensures the lowest possible thermal resistance at the contact point. ### C. Fin Geometry The "Fine-Pitch" design maximizes surface area within a small 35mm footprint. * **Cross-cut pattern:** Allows for airflow from multiple directions, making it ideal for systems where the fan placement might not be perfectly aligned with the heat sink. --- ### 3. Usage Context This part is typically used in the following scenarios: 1. **Networking Hardware:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs). --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM** | 3.32 | | **300 LFM** | 2.11 | | **500 LFM** | 1.73 |