ATS-05B-153-C2-R0
AI

The **ATS-05B-153-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 4.05°C/W (at 100 LFM) |
| **Base Dimensions** | 40mm x 40mm |
| **Height** | 20mm |
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### 2. Key Design Components
#### A. Fin Profile (Straight Fin)
This model uses a **straight-fin design**, which is optimized for high-performance airflow environments. The spacing between the fins is engineered to provide a balance between surface area for heat exchange and low pressure drop for the cooling fan.
#### B. pushPIN™ Attachment
The "pushPIN" system is a mounting mechanism that replaces traditional adhesive tapes or clumsy clips. It consists of:
* **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic chip, which is critical for efficient heat transfer.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that the unit comes pre-applied with **T766 phase-change material** or a high-quality thermal grease. This fills the microscopic air gaps between the chip and the heat sink base.
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### 3. Thermal Performance Matrix
Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 4.05 |
| 300 | 1.5 | 2.14 |
| 500 | 2.5 | 1.70 |
| 700 | 3.5 | 1.49 |
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### 4. Component Material Properties
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases the **emissivity** of the surface, slightly improving heat radiation and providing corrosion resistance.
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- ⤷How do I calculate if this heat sink is sufficient for a 15W component?
- ⤷ What are the specific hole dimensions required on the PCB for the pushPIN system?
- ⤷ Is there a version of this heat sink with a different height or attachment method?