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  • ATS-05B-153-C2-R0

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    The **ATS-05B-153-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.05°C/W (at 100 LFM) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 20mm | --- ### 2. Key Design Components #### A. Fin Profile (Straight Fin) This model uses a **straight-fin design**, which is optimized for high-performance airflow environments. The spacing between the fins is engineered to provide a balance between surface area for heat exchange and low pressure drop for the cooling fan. #### B. pushPIN™ Attachment The "pushPIN" system is a mounting mechanism that replaces traditional adhesive tapes or clumsy clips. It consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic chip, which is critical for efficient heat transfer. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the unit comes pre-applied with **T766 phase-change material** or a high-quality thermal grease. This fills the microscopic air gaps between the chip and the heat sink base. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.05 | | 300 | 1.5 | 2.14 | | 500 | 2.5 | 1.70 | | 700 | 3.5 | 1.49 | --- ### 4. Component Material Properties * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases the **emissivity** of the surface, slightly improving heat radiation and providing corrosion resistance. ---
    ✨ Follow-up Questions
    • ⤷How do I calculate if this heat sink is sufficient for a 15W component?
    • ⤷ What are the specific hole dimensions required on the PCB for the pushPIN system?
    • ⤷ Is there a version of this heat sink with a different height or attachment method?