Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-05B-166-C3-R0

  • AI
    The **ATS-05B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" series designed for securing the cooler to a Printed Circuit Board (PCB). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Square Pin Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Component Breakdown ### A. Fin Geometry (Square Pin Fin) The "166" in the part number refers to the specific geometry. The **Square Pin Fin** design is highly effective in "omni-directional" airflow environments. Unlike straight-fin heat sinks, pin fins allow air to enter the heat sink from any angle, making it ideal for crowded PCBs where airflow direction may be unpredictable. ### B. Attachment Mechanism (Push-Pin & Spring) The `-R0` suffix indicates the standard revision. It uses a push-pin assembly: * **Plastic Push-Pins:** Quickly snap into pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the heat-generating component (CPU, GPU, or MOSFET), which is critical for maximizing heat transfer. ### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. This is a "Phase Change Material" that fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance compared to a dry fit. --- ## 3. Usage Context This part is typically used for cooling small-form-factor electronics, such as: * **Network Switches/Routers:** Cooling ASICs or SoCs. * **Embedded Systems:** Industrial PCs where space is limited. * **Power Supplies:** Cooling voltage regulators or power transistors. ---
    ✨ Follow-up Questions
    • ⤷ How do I calculate if the 12.30°C/W thermal resistance is sufficient for my component?
    • ⤷ What is the specific PCB hole size required for the ATS push-pin mount?
    • ⤷ Does the Blue Anodized finish affect the thermal performance compared to raw aluminum?