ATS-05B-199-C2-R0
AI

The **ATS-05B-199-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
This part is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or FPGAs.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 15.83°C/W (Unducted Flow @ 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Physical Dimensions
The dimensions are critical for PCB layout and ensuring clearance from other components.
* **Length:** 50.00 mm
* **Width:** 50.00 mm
* **Height:** 6.00 mm (Low profile)
* **Fin Pitch:** Straight Fin design
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## 3. Component Breakdown
### A. The Heat Sink Body
The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling.
### B. Push-Pin Mounting System
Instead of using messy adhesives or permanent thermal tape, this part uses **plastic push-pins** with high-tension springs.
* **Reliability:** Provides consistent pressure across the chip surface for optimal heat transfer.
* **Maintenance:** Allows for easy removal and re-installation compared to epoxy-based solutions.
### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. This is a "phase change" or high-performance thermal pad that fills microscopic air gaps between the heat source and the aluminum surface, significantly lowering thermal impedance.
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## 4. Performance Metrics (Airflow)
The efficiency of this part varies based on the velocity of air (measured in Linear Feet per Minute - LFM) moving through the fins:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 15.83 |
| 400 | 10.70 |
| 600 | 8.20 |
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- ⤷How does the T766 thermal material compare to standard thermal paste?
- ⤷ What size PCB holes are required for these specific push-pins?
- ⤷ Can this heat sink be used for passive cooling without a fan?