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  • ATS-05B-199-C2-R0

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    The **ATS-05B-199-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This part is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 15.83°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions The dimensions are critical for PCB layout and ensuring clearance from other components. * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height:** 6.00 mm (Low profile) * **Fin Pitch:** Straight Fin design --- ## 3. Component Breakdown ### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. ### B. Push-Pin Mounting System Instead of using messy adhesives or permanent thermal tape, this part uses **plastic push-pins** with high-tension springs. * **Reliability:** Provides consistent pressure across the chip surface for optimal heat transfer. * **Maintenance:** Allows for easy removal and re-installation compared to epoxy-based solutions. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a "phase change" or high-performance thermal pad that fills microscopic air gaps between the heat source and the aluminum surface, significantly lowering thermal impedance. --- ## 4. Performance Metrics (Airflow) The efficiency of this part varies based on the velocity of air (measured in Linear Feet per Minute - LFM) moving through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 15.83 | | 400 | 10.70 | | 600 | 8.20 | ---
    ✨ Follow-up Questions
    • ⤷How does the T766 thermal material compare to standard thermal paste?
    • ⤷ What size PCB holes are required for these specific push-pins?
    • ⤷ Can this heat sink be used for passive cooling without a fan?