ATS-05B-20-C2-R0
AI

The **ATS-05B-20-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
Below are the primary mechanical and thermal characteristics:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) with Compression Spring |
| **Fin Style** | Straight Fin |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Electronic Application & Function
This part acts as a **Passive Heat Exchanger**. In an electronic circuit, its role is defined by the following mechanisms:
* **Heat Transfer:** It conducts heat away from the semiconductor die via the Thermal Interface Material (TIM).
* **Convection Surface:** The 45x45mm aluminum body increases the surface area exposed to the air, allowing forced air (fans) or natural convection to carry heat away.
* **Mechanical Protection:** The push-pin mechanism provides specific downward pressure (clamping force), ensuring the component remains in electrical and thermal contact with the PCB without damaging the delicate silicon.
---
### 3. Key Electronic Features
* **Pre-drilled for Push-Pins:** The heat sink comes with standardized hole patterns (38mm pitch) to snap directly into the PCB.
* **T766 TIM:** This is a phase-change thermal interface material. When the electronic part heats up, the material softens to fill microscopic air gaps between the chip and the heat sink, maximizing thermal conductivity.
* **Blue Anodized Coating:** Beyond aesthetics, the anodization provides a layer of electrical insulation and protects the aluminum from corrosion in humid environments.
---
### 4. Naming Convention Breakdown
The part number follows the ATS standard nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **05:** Series/Family.
* **B:** Material (Aluminum).
* **20:** Height (25mm in this specific series configuration).
* **C2:** Thermal performance/Fin density indicator.
* **R0:** Revision/Packaging code.
- ⤷
What is the required PCB hole diameter for the push-pins used in this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used for natural convection without a fan?