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  • ATS-05B-20-C2-R0

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    The **ATS-05B-20-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Fin Style** | Straight Fin | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic Application & Function This part acts as a **Passive Heat Exchanger**. In an electronic circuit, its role is defined by the following mechanisms: * **Heat Transfer:** It conducts heat away from the semiconductor die via the Thermal Interface Material (TIM). * **Convection Surface:** The 45x45mm aluminum body increases the surface area exposed to the air, allowing forced air (fans) or natural convection to carry heat away. * **Mechanical Protection:** The push-pin mechanism provides specific downward pressure (clamping force), ensuring the component remains in electrical and thermal contact with the PCB without damaging the delicate silicon. --- ### 3. Key Electronic Features * **Pre-drilled for Push-Pins:** The heat sink comes with standardized hole patterns (38mm pitch) to snap directly into the PCB. * **T766 TIM:** This is a phase-change thermal interface material. When the electronic part heats up, the material softens to fill microscopic air gaps between the chip and the heat sink, maximizing thermal conductivity. * **Blue Anodized Coating:** Beyond aesthetics, the anodization provides a layer of electrical insulation and protects the aluminum from corrosion in humid environments. --- ### 4. Naming Convention Breakdown The part number follows the ATS standard nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **05:** Series/Family. * **B:** Material (Aluminum). * **20:** Height (25mm in this specific series configuration). * **C2:** Thermal performance/Fin density indicator. * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the required PCB hole diameter for the push-pins used in this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used for natural convection without a fan?