The **ATS-05B-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on printed circuit boards (PCBs). ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.83°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Fin Style** | XC-Cut (Cross-Cut) | --- ### 2. Key Component Features #### A. XC-Cut Fin Design The heat sink features a **cross-cut (XC)** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a single predictable direction. #### B. Attachment Mechanism (Push Pins) Instead of adhesive tapes, this model uses a **brass push pin** system. * **Advantage:** Provides a secure, high-pressure fit that ensures the heat sink remains in contact with the component even under mechanical vibration. * **Requirement:** The PCB must have pre-drilled holes to accommodate the pins. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiation heat transfer, and provides a layer of protection against corrosion. --- ### 3. Thermal Performance Profile Thermal resistance is the measure of how effectively the heat sink removes heat. As airflow (measured in Linear Feet per Minute - LFM) increases, resistance decreases: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 14.83 | | 200 | 8.29 | | 400 | 4.77 | | 600 | 3.44 | --- ### 4. Implementation Considerations 1. **TIM (Thermal Interface Material):** This model typically comes with a pre-applied thermal interface (Phase Change Material or Thermal Tape) to fill microscopic air gaps between the component and the heat sink base. 2. **Clearance:** Ensure that the 54mm x 54mm footprint does not interfere with nearby tall capacitors or headers on the PCB. 3. **Hole Pattern:** The PCB must match the specific pitch (distance) of the push pins provided in the ATS-05B series datasheet.