The **ATS-05B-207-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.39°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 60mm x 60mm x 6mm | | **Fin Style** | XC-Cut (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (XC-Cut) The "XC-Cut" refers to a cross-cut fin pattern. Unlike straight fins, these create a series of independent pins or blocks. This is electronically beneficial because: - It allows for **multi-directional airflow**, meaning the component remains cool regardless of how the system fan is oriented. - It increases the surface area for heat dissipation while maintaining a low profile (6mm height). #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex screws, this part uses a **push-pin and spring mechanism**: - **Reliability:** Provides consistent downward pressure on the electronic chip, ensuring optimal contact with the die. - **Safety:** Prevents the heat sink from shifting during vibration, which could otherwise short-circuit nearby surface-mount components. #### C. Thermal Interface Material (T766) The unit comes with **T766** pre-applied to the base. - This material fills the microscopic air gaps between the heat sink and the electronic package (e.g., a BGA or FPGA). - It ensures efficient heat transfer, preventing the junction temperature ($T_j$) of the semiconductor from exceeding safe limits. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 13.0 | | 200 (Moderate) | 6.4 | | 400 (High) | 3.5 | --- ### Summary of Benefits 1. **Low Profile:** At only 6mm high, it is ideal for 1U server racks and slim electronic enclosures. 2. **Efficiency:** The blue anodized finish is not just for aesthetics; it provides improved surface emissivity. 3. **Easy Integration:** The push-pin design allows for rapid assembly in manufacturing environments.