The part number **ATS-05B-22-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for thermal management of electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 54.00mm x 40.00mm | | **Height (Fin)** | 12.70mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 13.87°C/W (at 100 LFM) | | **Fin Pattern** | XC-CUT | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism consisting of: * **Brass Push Pins:** Designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent pressure (Force) between the heat sink and the electronic component to ensure optimal heat transfer. ### B. XC-CUT Fin Design The "XC-CUT" refers to a cross-cut fin geometry. This design is highly effective for: * **Multi-directional airflow:** It allows air to enter and exit from different angles, which is critical in densely packed electronic enclosures. * **Surface Area Maximization:** Increases the cooling surface area relative to the physical footprint. ### C. Thermal Interface Material (TIM) The **-R0** suffix typically indicates that the part comes with a pre-applied high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal paste and ensures a low thermal resistance bond between the chip and the aluminum base. --- ## 3. Application Use Cases This specific heat sink is used in electronics where vertical space is limited (12.7mm height) but horizontal surface area is available. * **Telecommunications:** Cooling of networking processors in switches and routers. * **Industrial PC:** Cooling of embedded modules. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators. ---