The **ATS-05B-24-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" heat sink assembly system, designed specifically to provide efficient thermal management for electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 20.00mm | | **Thermal Resistance** | 8.37°C/W (Unducted Flow @ 100 LFM) | | **Flow Pattern** | Fine-pitch straight fin design | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "Fine Pitch" straight fin design increases the surface area available for heat dissipation, making it ideal for systems with high-velocity airflow. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system. * **Spring-loaded:** Ensures constant, high pressure against the electronic component, which improves thermal transfer. * **Reliability:** Mechanical mounting is more durable than thermal tape in high-vibration or high-temperature environments. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **ATS-T766**. This is a high-performance thermal grease that fills microscopic air gaps between the component's surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown To understand the electronic application better, here is how the part number is decoded: * **ATS**: Advanced Thermal Solutions. * **05**: Part series/design identifier. * **B**: Aluminum material. * **24**: Specific footprint size (60mm x 60mm). * **C2**: Specific height and fin configuration (20mm height). * **R0**: RoHS compliant and standard packaging. --- ### 4. Typical Applications This component is generally used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. 3. **Industrial Computing:** Maintaining safe operating temperatures for embedded processors.