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  • ATS-05B-29-C2-R0

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    The **ATS-05B-29-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ## 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance (Flow)** | 7.57 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Fin Style** | Straight Fin | | **Spring Type** | ATS-PPS-05 | --- ## 2. Key Components & Design Features ### A. The push-PIN™ Attachment Unlike adhesive tapes or heavy clips, this part uses the **push-PIN™** system. It consists of: * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes on a PCB. * **Compression Springs:** These provide precise, uniform pressure (Force) across the component surface, ensuring optimal thermal interface contact. ### B. Material and Finish * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiative cooling and providing corrosion resistance. ### C. Thermal Performance The "C2" in the part number indicates a specific thermal interface material (TIM) or performance tier. This heat sink is engineered to maximize surface area within a 45mm footprint, using a straight-fin design that is most effective in environments with directed airflow (forced convection). --- ## 3. Applications This part is commonly used in: * **Telecommunications:** High-speed routers and switches. * **Industrial PC (IPC):** Control boards and embedded systems. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between straight fin and cross-cut fin heat sinks?
    • ⤷ How do I calculate the required LFM for this heat sink?
    • ⤷ Are there alternative mounting options if my PCB lacks push-pin holes?