The **ATS-05B-31-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Pattern** | Straight / Fine Pitch | | **Attachment Type** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance (Unducted)** | 25.25 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.26 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### ## Key Electronic & Mechanical Features ### 1. Thermal Management The primary purpose of this part is to dissipate heat from high-power electronic components. It utilizes a **Fine Pitch** fin design, which maximizes the surface area for heat exchange in small form factors. ### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this uses a spring-loaded pin system. This provides several benefits for circuit board (PCB) design: * **Constant Pressure:** Ensures optimal contact with the electronic component. * **Secure Fit:** Prevents the heat sink from shifting during vibration or transport. * **Serviceability:** Allows the heat sink to be removed and re-installed easily without damaging the PCB. ### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal grease. This fills the microscopic air gaps between the component and the heat sink base, significantly reducing thermal impedance. ### 4. Material and Finish The aluminum construction provides a balance between weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and improves the emissivity of the surface. --- ### ## Component Layout The pin spacing and mounting holes are standardized for integration into industrial and consumer electronics: * **Pitch (Hole-to-Hole):** 43.00mm * **Pin Length:** Pre-cut to match standard PCB thicknesses. * **Airflow Direction:** Designed for cross-flow environments where air is pushed through the fins.