The **ATS-05B-33-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions** | 35mm x 35mm x 20mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Stainless Steel (R0) | | **Thermal Interface** | T766 Phase Change Material (Pre-applied) | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System This part utilizes a "push-pin" mechanism, which is a standardized mounting method for PCBs. It consists of a plastic pin and a high-tension spring. * **Benefits:** Ensures consistent pressure on the component to maximize thermal transfer while preventing damage to the PCB. * **Easy Installation:** Features pre-drilled holes for rapid assembly on the production line. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the presence of **T766 thermal grease/material**. * This material is pre-applied to the bottom surface. * It fills microscopic gaps between the heat sink and the electronic chip to ensure the best possible heat conduction. #### C. Cross-Cut Fin Design The fin structure is designed to allow air to flow from multiple directions. This is particularly useful in dense electronic enclosures where airflow direction might not be strictly linear. --- ### 3. Part Number Breakdown The nomenclature used by ATS provides specific details about the component: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **05** | Push-pin size/style | | **B** | Series indicator | | **33** | Dimension code (35mm x 35mm) | | **C2** | Thermal Interface Material (T766) | | **R0** | Material and Finish code (Blue Anodized Aluminum) | --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Networking:** Keeping routers and switches within safe operating temperatures. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.