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  • ATS-05B-60-C2-R0

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    The **ATS-05B-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance (Unducted)** | 6.36 °C/W @ 100 LFM | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | XCUT (Straight Fins) | --- ### 2. Key Design Elements #### A. Thermal Interface Material (TIM) The part number suffix **"C2"** indicates that the heat sink comes pre-applied with **T766 thermal grease**. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. #### B. Attachment Mechanism (pushPIN™) Instead of using messy adhesives or simple clips, this model uses a **pushPIN™** system: * **Springs:** Provide precise, consistent pressure across the component surface. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Fin Geometry The **XCUT** design features straight fins that are optimized for vertical or horizontal airflow. The **25mm height** provides a large surface area for heat dissipation while remaining compact enough for 1U or 2U server rack configurations. --- ### 3. Performance Analysis The efficiency of the ATS-05B-60-C2-R0 is highly dependent on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** ~6.36 °C/W * **High Airflow (700 LFM):** ~1.45 °C/W *Note: A lower °C/W rating means the heat sink is more efficient at cooling.* ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ attachment?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with components larger than 40x40mm?