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  • ATS-05B-64-C2-R0

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    The **ATS-05B-64-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 9.39°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Pressure Type** | High Flow / Low Pressure | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The "64" in the part number refers to the specific fin geometry. These are typically **straight fin** designs, which provide a large surface area for heat dissipation. The aluminum construction ensures lightweight properties and high thermal conductivity. #### B. Attachment System (Push-Pin) Unlike adhesive-based heat sinks, this part uses a **Push-Pin and Compression Spring** mechanism: * **Material:** Brass pins for durability. * **Security:** Provides consistent pressure on the processor, ensuring better thermal contact than simple tape. * **Hole Pattern:** Requires pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The **C2** suffix indicates that the unit comes with **T766 phase-change material** or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application. #### D. Finish The **R0** suffix denotes compliance with environmental standards (RoHS) and the specific blue anodized finish, which protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ### 3. Application Use Cases * **Networking Equipment:** Routers and switches requiring stable cooling. * **Industrial PCs:** High-vibration environments where push-pins are more secure than adhesives. * **Power Supplies:** Cooling voltage regulators or MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the brass push-pins?
    • ⤷ How does the thermal resistance change at higher airflow (LFM) levels?
    • ⤷ What is the difference between the C1 and C2 versions of this heat sink?