ATS-05B-64-C2-R0
AI

The **ATS-05B-64-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Thermal Resistance** | 9.39°C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Pressure Type** | High Flow / Low Pressure |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Key Component Breakdown
#### A. The Heat Sink Body
The "64" in the part number refers to the specific fin geometry. These are typically **straight fin** designs, which provide a large surface area for heat dissipation. The aluminum construction ensures lightweight properties and high thermal conductivity.
#### B. Attachment System (Push-Pin)
Unlike adhesive-based heat sinks, this part uses a **Push-Pin and Compression Spring** mechanism:
* **Material:** Brass pins for durability.
* **Security:** Provides consistent pressure on the processor, ensuring better thermal contact than simple tape.
* **Hole Pattern:** Requires pre-drilled holes on the PCB (Printed Circuit Board).
#### C. Thermal Interface Material (TIM)
The **C2** suffix indicates that the unit comes with **T766 phase-change material** or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application.
#### D. Finish
The **R0** suffix denotes compliance with environmental standards (RoHS) and the specific blue anodized finish, which protects the aluminum from corrosion and slightly improves radiant heat transfer.
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### 3. Application Use Cases
* **Networking Equipment:** Routers and switches requiring stable cooling.
* **Industrial PCs:** High-vibration environments where push-pins are more secure than adhesives.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
What are the PCB hole diameter requirements for the brass push-pins?
- ⤷ How does the thermal resistance change at higher airflow (LFM) levels?
- ⤷ What is the difference between the C1 and C2 versions of this heat sink?