The **ATS-05B-90-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Components The "Electronic Parts" involved in this assembly are not active circuits, but rather mechanical-thermal components: * **Heat Sink Body:** Features a high-fin-density design to maximize surface area for convective heat transfer. * **Push-Pin Attachment:** This model uses a brass push-pin mechanism. It is designed to go through pre-drilled holes in the Printed Circuit Board (PCB), providing a secure and consistent mounting force. * **Compression Springs:** These ensure that the heat sink maintains high pressure against the electronic chip, minimizing the air gap. * **T766 TIM:** This is a phase-change thermal interface material applied to the base. It fills microscopic imperfections between the chip and the heat sink to improve heat conductivity. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (LFM - Linear Feet per Minute) provided by the system's fans: | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 6.36 | | **200 (Unducted)** | 4.33 | | **400 (Unducted)** | 3.10 | | **600 (Unducted)** | 2.50 | --- ### 4. Implementation Details To use the ATS-05B-90-C2-R0, the PCB layout must account for: 1. **Hole Pattern:** Two holes spaced specifically for the 40mm frame. 2. **Keep-out Zone:** Ensure no surface-mount components (SMD) are placed directly under the heat sink footprint that could interfere with the base contact.