The **ATS-05B-91-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (High Performance) | --- ### 2. Electronic Application Features #### A. Thermal Resistance This part is engineered to dissipate heat efficiently. The effectiveness depends on the airflow (Measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** ~6.00 °C/W * **High Airflow (600 LFM):** ~3.20 °C/W #### B. Attachment Mechanism The "Push-Pin" system utilizes a spring-loaded mechanism. This is critical for electronics because: * It ensures **constant pressure** across the component surface for maximum heat transfer. * It protects the PCB from mechanical stress via the calibrated spring tension. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates it comes pre-applied with **T412**. This is a phase-change material that fills microscopic air gaps between the chip and the heatsink, significantly reducing thermal impedance. --- ### 3. Naming Convention Breakdown The part number follows a specific logic used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **05B** | Series/Mounting configuration | | **91** | Specific Dimension code (40x40mm) | | **C3** | Material/Height code (10mm Aluminum) | | **R0** | Packaging/TIM configuration (Pre-applied T412) | --- ### 4. Typical Use Cases * **Networking Gear:** Switches and Routers where vertical space is limited (10mm height). * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or high-speed voltage regulators.