The **ATS-05B-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance** | 1.62 °C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **RoHS Status** | Compliant | --- ### 2. Key Design Elements #### A. Fin Geometry (maxiFLOW™) The "94" in the part number indicates a specific fin pattern. The maxiFLOW design utilizes a spread-fin geometry that increases surface area while minimizing pressure drop. This is critical for systems with limited airflow, as it allows air to pass through more efficiently compared to standard square-fin heat sinks. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **ATS-05B** series uses a pushPIN mechanism: * **Reliability:** Provides consistent pressure to the interface material (TIM). * **Ease of Install:** Uses a brass or plastic pin with a high-tension spring. * **Safety:** Prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes pre-applied with **T766 Phase Change Material** or a high-performance thermal grease. This ensures low thermal impedance between the electronic component (CPU, GPU, or FPGA) and the aluminum base. --- ### 3. Electronic Application This part is commonly used to cool the following electronic components: 1. **FPGAs & ASICs:** Used in telecommunications and networking gear. 2. **Processors:** Cooling embedded CPUs in industrial computing. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power converters. ---