The **ATS-05B-95-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS) push-pin heatsink** designed for cooling integrated circuits (ICs) such as CPUs, GPUs, and high-power chipsets. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here is the breakdown of its physical and performance characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin (High Surface Area) | | **Thermal Resistance** | 7.29 °C/W (at 200 LFM) | | **Attachment Type** | Push-Pin (Standard 2-Pin configuration) | | **Thermal Interface** | T766 (High-performance Phase Change Material) | --- ### 2. Physical Design Components This part is comprised of three main sub-components that work together to manage heat: * **The Heat Sink Body:** Constructed from high-quality aluminum for thermal conductivity. The straight fin design is optimized for airflow from system fans. * **Push-Pin Attachment:** The "B" in the part number denotes a specific spring-loaded push-pin assembly. This provides consistent pressure (3.0 lbs force) on the chip to maximize heat transfer across the interface. * **Thermal Interface Material (TIM):** The part comes pre-applied with **T766**, a phase-change material. This fills the microscopic air gaps between the chip and the heatsink base, significantly reducing thermal resistance compared to air. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) varies based on the Air Velocity (LFM - Linear Feet per Minute). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 14.90 | | **200 (Moderate)** | 7.29 | | **300 (Active)** | 5.23 | | **500 (High)** | 3.73 | --- ### 4. Application and Use Cases The ATS-05B-95-C2-R0 is typically used in environments where reliability and high heat dissipation are required in a compact form factor: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Industrial PCs:** Motherboards requiring active airflow cooling. 3. **Power Supplies:** Cooling MOSFETs or power regulators. ---