The **ATS-05B-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for high-power electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the core electronic and physical characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Mounting Type** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Features ### A. maxiFLOW™ Fin Geometry The "B" in the part number indicates a specific fin pattern. The maxiFLOW design features a spread-fin geometry that maximizes surface area and increases turbulence, which significantly improves the convection heat transfer from the electronic component to the ambient air. ### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. This is critical for electronics because: * **Constant Pressure:** It ensures uniform contact between the heat sink and the chip. * **Reliability:** It prevents the heat sink from shifting or falling off during high-vibration scenarios (e.g., in industrial machinery). * **Ease of Maintenance:** It allows for easy removal and re-application of thermal paste. ### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the chip surface and the heat sink base, ensuring low thermal resistance. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying the exact variant: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **05** | Attachment Type (pushPIN) | | **B** | Fin Design (maxiFLOW) | | **96** | Specific Heat Sink Series/Family | | **C2** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant / Revision level | --- ## 4. Application Environments This part is typically found in: * **Telecommunications:** Cooling network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or power modules.