The **ATS-05D-06-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Square Fin (Cross-cut) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Pressure Spring** | Stainless Steel | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Cross-Cut Fin Design The heat sink features a square-fin or "cross-cut" pattern. This allows for **multi-directional airflow**, meaning the heat sink can dissipate heat effectively regardless of whether the air is moving horizontally or vertically across the board. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **brass push-pin** system. * **Ease of Maintenance:** Allows for easy removal and re-installation. * **Consistency:** Provides uniform pressure across the component surface for optimal heat transfer. #### 3. Pre-applied Thermal Interface Material (TIM) The base comes with **T766** thermal grease or pad pre-applied. This simplifies the assembly process in a production environment and ensures that there are no air gaps between the heat sink and the electronic chip. #### 4. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides a protective layer against corrosion and slightly increases emissivity for better radiative cooling. --- ### Application Use Cases This specific heat sink is typically found in: * **Embedded Systems:** Cooling high-speed processors on industrial motherboards. * **Telecommunications:** Transceiver modules and network switches. * **Power Electronics:** Managing heat for power MOSFETs or high-density voltage regulators.