The **ATS-05D-07-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "pushPIN™" series. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-05D-07-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heatsink fits within the PCB layout without interfering with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Width / Length** | 45.00 mm x 45.00 mm | | **Height (Off Base)** | 12.70 mm | | **Fin Pitch** | COARSE-PITCH | | **Fin Pattern** | STRAIGHT | | **Mounting Hole Spacing** | 38.00 mm | --- ### 3. Key Electronic Functions The ATS-05D-07-C3-R0 serves several critical roles in an electronic assembly: * **Heat Dissipation:** It increases the surface area of the heat source (like a CPU, GPU, or MOSFET), allowing air to carry away thermal energy more efficiently. * **Thermal Protection:** By maintaining lower operating temperatures, it prevents "thermal throttling" and extends the lifespan of semiconductor junctions. * **Pre-Applied TIM:** The inclusion of **T412 thermal interface material** ensures there are no microscopic air gaps between the component and the heatsink, maximizing heat transfer. --- ### 4. Mounting Mechanism (pushPIN™) The "pushPIN™" system is a specific engineering choice for this part: 1. **Spring-Loaded:** It uses a brass or plastic pin with a stainless steel spring. 2. **Consistent Pressure:** This ensures even "clamping force" across the chip, which is vital for thermal efficiency. 3. **Ease of Assembly:** It allows for quick installation on the PCB through pre-drilled holes.