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  • ATS-05D-100-C2-R0

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    The **ATS-05D-100-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin Mount) | | **Material** | Aluminum | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Anodized Finish** | Blue Anodized | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design allows for maximum airflow through the sink, which is ideal for systems with high-velocity cooling fans. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-05D-100-C2-R0** uses a mechanical push-pin system: - **Pins:** Usually made of brass or plastic; these insert into pre-drilled holes on the PCB. - **Springs:** These provide consistent downward pressure, ensuring the heat sink stays flush against the chip even during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 4.84 | | **400 (2.0 m/s)** | 3.25 | | **600 (3.0 m/s)** | 2.73 | | **800 (4.0 m/s)** | 2.44 | --- ### 4. Part Number Decoder Understanding the naming convention helps in identifying the specific variant: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **05:** Series/Pin Type. * **D:** Plastic or Brass Pin material code. * **100:** Dimensions/Fin height code. * **C2:** Material finish (Blue Anodized). * **R0:** RoHS Compliance status.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for this push-pin model?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a low-profile version of this heat sink for height-constrained enclosures?