ATS-05D-100-C2-R0
AI

The **ATS-05D-100-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink (Push-Pin Mount) |
| **Material** | Aluminum |
| **Dimensions (L x W x H)** | 25mm x 25mm x 25mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Anodized Finish** | Blue Anodized |
---
### 2. Key Component Breakdown
#### A. The Heat Sink Body
The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design allows for maximum airflow through the sink, which is ideal for systems with high-velocity cooling fans.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the **ATS-05D-100-C2-R0** uses a mechanical push-pin system:
- **Pins:** Usually made of brass or plastic; these insert into pre-drilled holes on the PCB.
- **Springs:** These provide consistent downward pressure, ensuring the heat sink stays flush against the chip even during mechanical shock or vibration.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance.
---
### 3. Thermal Performance Data
Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 4.84 |
| **400 (2.0 m/s)** | 3.25 |
| **600 (3.0 m/s)** | 2.73 |
| **800 (4.0 m/s)** | 2.44 |
---
### 4. Part Number Decoder
Understanding the naming convention helps in identifying the specific variant:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **05:** Series/Pin Type.
* **D:** Plastic or Brass Pin material code.
* **100:** Dimensions/Fin height code.
* **C2:** Material finish (Blue Anodized).
* **R0:** RoHS Compliance status.
- ⤷
What are the PCB hole diameter requirements for this push-pin model?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a low-profile version of this heat sink for height-constrained enclosures?