The **ATS-05D-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | |:---|:---| | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 10.00mm | | **Fin Pattern** | COARSE-PITCH | | **Fin Type** | XCUT | | **Thermal Resistance (Unducted)** | 8.68 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Fin Design (XCUT & Coarse-Pitch) The "XCUT" geometry provides a multi-directional airflow pattern. In electronic enclosures where airflow might be turbulent or non-linear, this design ensures that heat is dissipated effectively regardless of the direction the cooling fan is blowing. #### B. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, the pushPIN™ system uses a brass component and a stainless steel spring. * **Reliability:** Provides consistent pressure (clamping force) across the processor or component, which is critical for long-term thermal stability. * **Ease of Assembly:** Features pre-drilled holes for quick installation on a PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-conductivity material that fills the microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink, significantly reducing contact resistance. --- ### 3. Application Use Cases This specific heat sink is typically used for low-profile cooling requirements due to its 10mm height: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For use in compact industrial computers where vertical space is limited. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators in DC-DC converters. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | |:---|:---:|:---:|:---:|:---:|:---:| | **Resistance (°C/W)** | 8.68 | 4.05 | 3.14 | 2.71 | 2.45 |