The **ATS-05D-134-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 20.00mm | | **Thermal Resistance** | 4.44°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Base Shape** | Square | | **Compliance** | RoHS / REACH | --- ### 2. Electronic/Thermal Design Features #### **A. Fin Geometry** The "D" in the part number often indicates a specific fin pattern. This heat sink uses a **tapered fin design** which increases the surface area while reducing pressure drop, allowing air to flow more efficiently through the cooling fins. #### **B. Attachment Mechanism: pushPIN™** Instead of using messy thermal adhesives or unreliable clips, this part uses the **pushPIN™** system: * **Spring-loaded mechanism:** Ensures a constant, high-pressure contact between the heat sink and the electronic component. * **Flexible Mounting:** It can be adapted to various PCB thicknesses. #### **C. Thermal Interface Material (TIM)** The "R0" at the end of the part number typically indicates that the product comes with **pre-applied thermal interface material**. This ensures optimal heat transfer from the electronic chip to the aluminum body without the need for manual paste application. --- ### 3. Application Use-Cases This specific size (37mm) is common in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Computing:** Cooling industrial-grade single-board computers. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. ---