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  • ATS-05D-141-C2-R0

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    The **ATS-05D-141-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Thermal Resistance** | 15.70°C/W (Unducted Flow @ 100 LFM) | | **Fin Configuration** | Fine Pitch (Cross-Cut) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Electronic/Thermal Functionality While the part itself does not contain active circuitry (it is a passive component), its role is critical to the stability of electronic systems: * **Heat Dissipation:** It increases the surface area of a heat-generating semiconductor (such as a BGA, CPU, or FPGA), allowing the ambient air to carry away heat more efficiently. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that fills microscopic air gaps between the chip and the heat sink. * **Thermal Efficiency:** The "Fine Pitch" design is optimized for high-density boards where airflow might be limited but thermal requirements are high. --- ### 3. Component Breakdown The part number can be decoded to understand its construction: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **05:** Series/Designator. * **D:** Performance characteristic. * **141:** Specific geometry and fin height. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code. ### 4. Integration Code Example When designing a PCB, thermal engineers often simulate the heat dissipation. In a thermal modeling script, the parameters for this part might look like this: ```json { "part_number": "ATS-05D-141-C2-R0", "dimensions": { "length": 25.0, "width": 25.0, "height": 10.0, "unit": "mm" }, "material": "AL-6063", "thermal_conductivity": 200, "attachment": "Push-Pin" } ```
    ✨ Follow-up Questions
    • ⤷What is the compatible mounting hole diameter for this pushPIN heat sink?
    • ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM) than the pre-applied T766?