AI

The **ATS-05D-141-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 10mm |
| **Thermal Resistance** | 15.70°C/W (Unducted Flow @ 100 LFM) |
| **Fin Configuration** | Fine Pitch (Cross-Cut) |
| **Compliance** | RoHS and REACH Compliant |
---
### 2. Electronic/Thermal Functionality
While the part itself does not contain active circuitry (it is a passive component), its role is critical to the stability of electronic systems:
* **Heat Dissipation:** It increases the surface area of a heat-generating semiconductor (such as a BGA, CPU, or FPGA), allowing the ambient air to carry away heat more efficiently.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that fills microscopic air gaps between the chip and the heat sink.
* **Thermal Efficiency:** The "Fine Pitch" design is optimized for high-density boards where airflow might be limited but thermal requirements are high.
---
### 3. Component Breakdown
The part number can be decoded to understand its construction:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **05:** Series/Designator.
* **D:** Performance characteristic.
* **141:** Specific geometry and fin height.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision/Packaging code.
### 4. Integration Code Example
When designing a PCB, thermal engineers often simulate the heat dissipation. In a thermal modeling script, the parameters for this part might look like this:
```json
{
"part_number": "ATS-05D-141-C2-R0",
"dimensions": {
"length": 25.0,
"width": 25.0,
"height": 10.0,
"unit": "mm"
},
"material": "AL-6063",
"thermal_conductivity": 200,
"attachment": "Push-Pin"
}
```
- ⤷What is the compatible mounting hole diameter for this pushPIN heat sink?
- ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
- ⤷ 400 LFM)?
- ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM) than the pre-applied T766?