The **ATS-05D-149-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring Loaded) | | **Thermal Resistance** | 6.21°C/W (at 100 LFM / 0.5 m/s) | | **Fin Pattern** | Fine-Pitch (Cross-Cut) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 20.00 mm (Profile) * **Pitch/Spacing:** 40.00 mm (Between mounting holes) --- ### 3. Key Electronic Functions While the heat sink itself is passive (non-electrical), its electronic role is vital for system reliability: * **Thermal Management:** It conducts heat away from the semiconductor die to prevent thermal throttling or permanent hardware failure. * **Electromagnetic Compatibility (EMC):** The aluminum body and blue anodized finish can sometimes act as a minor shield, though its primary purpose is heat dissipation. * **Mechanical Stability:** The "C2" designation typically refers to a specific spring force provided by the push-pin mechanism, ensuring consistent contact pressure between the heat sink and the chip for optimal heat transfer. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.21 | | 300 (1.5 m/s) | 3.13 | | 500 (2.5 m/s) | 2.45 | | 700 (3.5 m/s) | 2.12 | --- ### 5. Part Number Breakdown `ATS-05D-149-C2-R0` * **ATS:** Advanced Thermal Solutions (Manufacturer) * **05:** Series/Designator * **D:** Material/Finish code * **149:** Dimensional footprint identifier * **C2:** Thermal Interface Material (TIM) and Spring Force specification * **R0:** Revision code/RoHS compliance status