The **ATS-05D-150-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Pattern** | Straight | | **Thermal Resistance** | 4.82 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (Fin)** | 25.00 mm | | **Mounting Hole Pitch** | 40.00 mm | --- ### 2. Electronic/Thermal Performance The primary "electronic" function of this part is thermal management. Heat sinks work by increasing the surface area in contact with the cooling medium (air) to dissipate heat generated by semiconductor junctions. * **Thermal Resistance (Airflow Dependent):** * **@100 LFM (0.5 m/s):** 4.82 °C/W * **@400 LFM (2.0 m/s):** 1.77 °C/W * **@700 LFM (3.5 m/s):** 1.35 °C/W * **Pressure Drop:** The straight fin design allows for efficient airflow with minimal resistance, which is critical in dense electronic enclosures. --- ### 3. Key Components of the Assembly The "C2" and "R0" suffixes in the part number refer to specific material and environmental compliance: 1. **Spring Mechanism:** Uses a brass/stainless steel spring to provide consistent downward pressure, ensuring maximum contact with the electronic component. 2. **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** high-performance thermal grease, which fills microscopic air gaps between the chip and the heat sink. 3. **Anodized Coating:** The Blue Anodized finish is not just for aesthetics; it provides corrosion resistance and improves emissivity for radiative heat transfer. --- ### 4. Compatibility and Standards * **RoHS & REACH:** Fully compliant with environmental standards for electronic manufacturing. * **Attachment Method:** Designed for PCB (Printed Circuit Board) mounting using pre-drilled holes, providing a more secure mechanical bond than adhesive tapes.