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  • ATS-05D-152-C2-R0

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    The **ATS-05D-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (typically Blue Anodized) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight Fin (Push-Pin) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Components & Design While the heat sink itself is passive, its design interacts directly with electronic principles: ### A. The Push-Pin Attachment System The **"R0"** designation refers to the attachment mechanism. - It uses a **Push-Pin** system with a compression spring. - This ensures consistent **clamping force** (pressure) on the electronic chip, which is vital for minimizing the thermal contact resistance between the component and the heat sink. ### B. Fin Configuration (Straight Fin) - This model uses a **Straight Fin** geometry. - In electronics cooling, straight fins are ideal for **forced-air cooling** (using a fan). They provide low pressure drop, allowing air to flow through the channels efficiently. ### C. Thermal Interface Material (TIM) - The unit comes pre-applied with **T766**. - This is a phase-change or grease-like material that fills microscopic air gaps between the electronic component’s surface and the heat sink base, significantly improving heat transfer efficiency. --- ## 3. Thermal Performance The efficiency of this part is measured by its thermal resistance ($^\circ \text{C/W}$), which indicates how much the temperature rises per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$) | | :--- | :--- | | 200 (1.0 m/s) | 4.63 | | 400 (2.0 m/s) | 2.50 | | 600 (3.0 m/s) | 1.88 | --- ## 4. Part Number Breakdown ```text ATS - 05 D - 152 - C2 - R0 | | | | | | | | | | | └─ Revision/Series | | | | └────── Color/Finish (Blue Anodized) | | | └──────────── Height Code (15.00mm) | | └───────────────── Fin Pitch (High Density) | └─────────────────── Heat Sink Series └──────────────────────── Advanced Thermal Solutions (Manufacturer) ```
    ✨ Follow-up Questions
    • ⤷What is the difference between push-pin and adhesive mounting for this heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ What are the hole spacing requirements on the PCB for the ATS-05D-152-C2-R0?