ATS-05D-152-C2-R0
AI

The **ATS-05D-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (typically Blue Anodized) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Fin Style** | Straight Fin (Push-Pin) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Electronic Components & Design
While the heat sink itself is passive, its design interacts directly with electronic principles:
### A. The Push-Pin Attachment System
The **"R0"** designation refers to the attachment mechanism.
- It uses a **Push-Pin** system with a compression spring.
- This ensures consistent **clamping force** (pressure) on the electronic chip, which is vital for minimizing the thermal contact resistance between the component and the heat sink.
### B. Fin Configuration (Straight Fin)
- This model uses a **Straight Fin** geometry.
- In electronics cooling, straight fins are ideal for **forced-air cooling** (using a fan). They provide low pressure drop, allowing air to flow through the channels efficiently.
### C. Thermal Interface Material (TIM)
- The unit comes pre-applied with **T766**.
- This is a phase-change or grease-like material that fills microscopic air gaps between the electronic component’s surface and the heat sink base, significantly improving heat transfer efficiency.
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## 3. Thermal Performance
The efficiency of this part is measured by its thermal resistance ($^\circ \text{C/W}$), which indicates how much the temperature rises per watt of power dissipated.
| Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$) |
| :--- | :--- |
| 200 (1.0 m/s) | 4.63 |
| 400 (2.0 m/s) | 2.50 |
| 600 (3.0 m/s) | 1.88 |
---
## 4. Part Number Breakdown
```text
ATS - 05 D - 152 - C2 - R0
| | | | | |
| | | | | └─ Revision/Series
| | | | └────── Color/Finish (Blue Anodized)
| | | └──────────── Height Code (15.00mm)
| | └───────────────── Fin Pitch (High Density)
| └─────────────────── Heat Sink Series
└──────────────────────── Advanced Thermal Solutions (Manufacturer)
```
- ⤷What is the difference between push-pin and adhesive mounting for this heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ What are the hole spacing requirements on the PCB for the ATS-05D-152-C2-R0?