Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-05D-153-C2-R0

  • AI
    The **ATS-05D-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | 4.05°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Omni-directional | --- ### 2. Key Design Features * **Fin Style (XC Cut):** The heat sink uses a "cross-cut" or pin-fin design. This allows for multi-directional airflow, making it effective in systems where the direction of the fan exhaust might vary. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **T766**, a high-performance phase-change material that ensures minimal air gaps between the heat sink and the chip. * **Push-Pin Attachment:** The "C2" in the part number indicates the use of plastic push-pins and springs. This provides a specific, consistent pressure (clamping force) to optimize heat transfer without damaging the PCB. --- ### 3. Electronic Application This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling networking chips and ASICs. 2. **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. 3. **Power Electronics:** Dissipating heat from high-speed voltage regulators. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **05D** | Series/Mounting specific (Push-pin type) | | **153** | Dimensions and fin configuration | | **C2** | Thermal Performance/Material grade | | **R0** | RoHS compliance status |
    ✨ Follow-up Questions
    • ⤷ What are the recommended mounting hole sizes for the push-pins?
    • ⤷ How does the 'C2' thermal material compare to standard thermal paste?
    • ⤷ What is the weight of this heat sink for PCB mechanical load calculations?