The **ATS-05D-162-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is essential in power electronics for thermal management. ### 1. General Specifications This part belongs to the **blue ICE™** series, designed specifically for high-efficiency heat dissipation in constrained spaces. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05D-162-C2-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 3.62°C/W (at 100 LFM) | | **Base Dimension** | 45mm x 45mm | | **Height** | 25mm | --- ### 2. Key Technical Features #### A. Thermal Resistance (Performance) The effectiveness of this heat sink is measured by its ability to transfer heat away from the semiconductor. * **Low Airflow (100 LFM):** ~3.62°C/W. * **High Airflow (700 LFM):** ~1.20°C/W. * *Note: Higher airflow significantly reduces the resistance, allowing for cooler operating temperatures of the electronic chip.* #### B. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **C2-R0** variant utilizes a push-pin mechanism: * **Pressure:** The spring-loaded pins provide precise, uniform pressure across the TIM (Thermal Interface Material). * **Reliability:** It ensures the heat sink remains securely attached even under mechanical vibration or thermal cycling. * **Spring Type:** The "R0" indicates a specific spring tension and pin length designed for a standard PCB thickness (usually 1.6mm). #### C. Fin Geometry The part uses a **Straight Fin** design. This is optimal for "tunnel" airflow or environments where the direction of the air is predictable and forced by a fan. --- ### 3. Electronic Application Usage This heat sink is typically found in the following electronic systems: 1. **FPGA/ASIC Cooling:** Often used on Xilinx or Altera chips where power density is high. 2. **Power Converters:** Cooling MOSFETs or IGBT modules. 3. **Network Switches:** Thermal management for high-speed processors in rack-mounted hardware. --- ### 4. Thermal Interface Material (TIM) The "C2" in the part number designates that this unit typically comes with **pre-applied Phase Change Material (PCM)** or high-performance thermal grease. This eliminates the need for manual application, ensuring a low-resistance contact between the silicon die and the aluminum base.