The **ATS-05D-166-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This component is designed to dissipate heat from surface-mount packages (like CPUs, GPUs, or FPGAs) into the surrounding air. | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Heat Sink Body * **Material:** Extruded aluminum is used for its high thermal conductivity and lightweight properties. * **Fin Design:** The straight-fin design allows for efficient airflow in one direction, making it ideal for systems with dedicated cooling fans. * **Anodization:** The blue anodized finish is not just aesthetic; it provides corrosion resistance and increased emissivity for radiation cooling. #### B. The Push-Pin Mounting System Instead of using messy thermal glues or permanent epoxies, this part uses a mechanical **Push-Pin** system: * **Quick Assembly:** Each pin has a built-in compression spring. * **Uniform Pressure:** The springs ensure consistent contact between the heat sink and the electronic component, which is critical for heat transfer. * **Hole Pattern:** Designed for specific PCB hole spacings (usually 20mm in this series). #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a phase-change material or thermal pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | |:---:|:---:| | 100 (Natural) | 12.30 | | 200 | 9.20 | | 400 | 7.10 | | 600 | 6.00 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small processors on industrial motherboards. * **Networking:** Heat management for high-speed Ethernet controllers. * **Power Supplies:** Managing thermals on voltage regulators or power ICs.