The **ATS-05D-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin attachment series designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.38°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 35mm x 35mm x 25mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Spring Type** | Brass | --- ### 2. Physical Design Elements * **Heat Sink Body:** Constructed from high-quality aluminum to provide low thermal resistance. The blue anodized finish increases emissivity and protects against corrosion. * **Fin Configuration:** It features a **Straight Fin/Cross-Cut** design. This allows for multi-directional airflow, making it versatile for different board orientations. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal phase-change material that ensures a tight thermal bond between the chip and the sink. --- ### 3. Attachment Mechanism (Push-Pin) The "05D" designation refers to the specific attachment hardware: 1. **Push-Pins:** Plastic pins that snap into pre-drilled holes on the PCB (typically 3.0mm holes). 2. **Compression Springs:** These provide a precise amount of downward pressure (clamping force) to maximize thermal contact without damaging the semiconductor or the solder joints. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 13.38 | | 400 (2.0 m/s) | 7.06 | | 600 (3.0 m/s) | 5.30 | | 800 (4.0 m/s) | 4.40 | --- ### 5. Common Applications * **BGA (Ball Grid Array) Cooling:** Used on processors and chipsets. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs and networking hardware where vertical clearance (25mm height) is available.