ATS-05D-19-C2-R0
AI

The **ATS-05D-19-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it does not contain silicon or circuitry, it is a critical thermal management component used to protect electronic parts from overheating.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 54.00mm x 54.00mm |
| **Height** | 20.00mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded bolts) |
| **Thermal Resistance** | 9.77°C/W (at 100 LFM) |
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### 2. Key Features of the Design
* **pushPIN™ Attachment:** This model uses a spring-loaded mechanism that ensures even pressure across the processor or component, preventing damage and maximizing heat transfer.
* **AL6063 Aluminum:** This specific grade of aluminum is chosen for its excellent thermal conductivity and structural integrity.
* **Blue Anodized Coating:** The finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving heat radiation.
* **High-Flow Design:** The straight-fin configuration is optimized for systems with consistent directional airflow.
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### 3. Applications in Electronics
The ATS-05D-19-C2-R0 is typically used to cool the following types of electronic parts:
1. **CPUs and Microprocessors:** Found in embedded systems or industrial PCs.
2. **ASICs and FPGAs:** Used in networking gear or signal processing where high heat is generated in a small area.
3. **Power Transistors:** Cooling MOSFETs or IGBTs in power supply units.
4. **LED Arrays:** Dissipating heat from high-output LED drivers.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on airflow (LFM - Linear Feet per Minute):
| Airflow Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 9.77 | 4.18 | 2.78 |
*Lower resistance is better, as it indicates the part can move heat away from the electronic component more efficiently.*
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How do I calculate the correct heat sink size for my specific electronic component?
- ⤷ What is the difference between pushPIN and adhesive tape mounting for heat sinks?
- ⤷ Are there copper versions of the ATS-05D-19-C2-R0 for better thermal conductivity?