The **ATS-05D-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specialized attachment mechanism for secure mounting. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | 1.32°C/W (at 200 LFM) | | **Attachment Method** | Push-pin (Spring Loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design (Fine Pitch) The "191" in the part number corresponds to a specific fin density and geometry. This model typically features a **cross-cut** or **straight fin** pattern designed to maximize surface area while maintaining a low pressure drop for airflow. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a mechanical push-pin system: * **Compression Springs:** Provide precise pressure (load) on the component to ensure optimal contact. * **Plastic/Brass Pins:** Secure the heat sink into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases The ATS-05D-191-C2-R0 is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC boards where vibration resistance is required. 3. **Power Electronics:** Cooling MOSFETs or IGBTs in power conversion modules. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow (Measured in Linear Feet per Minute - LFM):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.90 | | 300 | 1.5 | 1.08 | | 500 | 2.5 | 0.88 |