The **ATS-05D-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-05D-196-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 18.11°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Pattern** | Straight Fin | --- ### Key Features and Electronic Functionality #### 1. Heat Dissipation Mechanism In electronics, excessive heat leads to "thermal throttling" or hardware failure. This heat sink increases the surface area of the heat-generating component. The **Blue Anodized** finish is not just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat transfer. #### 2. pushPIN™ Attachment System This specific model uses the ATS pushPIN™ system, which includes: * **Compression Springs:** Ensure even pressure across the electronic chip for maximum contact. * **Plastic/Brass Pins:** Secure the sink through pre-drilled holes in the Printed Circuit Board (PCB). * **Thermal Interface Material (TIM):** Usually comes pre-applied (T766) to fill microscopic air gaps between the chip and the aluminum base. #### 3. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of this part depends on airflow within the electronic enclosure: * **Low Airflow (100 LFM):** 18.11°C/W resistance. * **High Airflow (700 LFM):** 2.47°C/W resistance. * *Interpretation:* At high airflow, the heat sink is significantly more effective at keeping the electronic junction temperature low. --- ### Applications in Electronics * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Embedded Systems:** Protecting ARM-based processors or FPGAs. * **Telecommunications:** Used on high-speed data processing boards where vertical space is limited (low profile 10mm height).