The **ATS-05D-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure they operate within safe temperature limits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 50mm x 50mm x 6mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.83°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Elements * **Low Profile (6mm Height):** This heat sink is exceptionally thin, making it ideal for high-density electronic assemblies where vertical space is constrained (e.g., 1U servers or thin client devices). * **Straight Fin Geometry:** The fins are arranged in a parallel, straight configuration. This design is optimized for **forced air cooling** (where a fan moves air through the fins) rather than natural convection. * **Blue Anodized Finish:** The aluminum is treated with a blue anodized coating which provides corrosion resistance and slightly improves thermal emissivity. --- ### 3. Attachment Mechanism (pushPIN™) The "05D" designation refers to the specific attachment kit used: 1. **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide a precise amount of "force" or pressure on the chip to ensure maximum thermal transfer without damaging the silicon or the board. 3. **Stability:** This mechanical attachment is more reliable than thermal adhesive tapes in environments subject to vibration or thermal cycling. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.83 | | 300 (1.5 m/s) | 8.99 | | 500 (2.5 m/s) | 7.39 | | 700 (3.5 m/s) | 6.48 | --- ### 5. Application Context The **ATS-05D-199-C2-R0** is typically used for: * **ASICs and FPGAs:** Mid-range chips that generate moderate heat in cramped enclosures. * **Power Modules:** Voltage regulators that require heat dissipation but have limited overhead clearance. * **Networking Gear:** Switches and routers where airflow is directed through a narrow chassis.