The **ATS-05D-20-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-performance thermal management in integrated circuits. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05D-20-C2-R0 | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 40.00mm x 15.00mm | | **Thermal Resistance** | 7.14°C/W (at 100 LFM) | --- ## 2. Key Electronic & Physical Components ### A. The Heat Sink Body The core component is an **extruded aluminum block** featuring a **Cross-Cut** fin design. This geometry is engineered to maximize surface area while allowing airflow from multiple directions, making it efficient for systems where air direction might change. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™ system**. - **Pre-assembled springs:** Provide a specific, consistent pressure (compression) on the electronic chip. - **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically signifies the inclusion of a high-performance **Thermal Interface Material (T766)** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the CPU/GPU to improve heat transfer. --- ## 3. Thermal Performance (Efficiency) Thermal performance is measured by how effectively the part moves heat away from the electronics into the ambient air. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.14 | | 300 (1.5 m/s) | 2.62 | | 500 (2.5 m/s) | 1.66 | --- ## 4. Typical Applications This part is commonly found in electronic assemblies requiring active or passive cooling for: * **Processors (CPUs/GPUs):** For small-form-factor industrial computers. * **ASICs & FPGAs:** High-speed integrated circuits that generate significant localized heat. * **Power Supplies:** Cooling transistors or voltage regulators.