The **ATS-05D-200-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Thermal Resistance** | 9.78 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Component Parts The assembly consists of four primary electronic/mechanical sub-components: #### A. The Heat Sink Body * **Design:** Features a **fine-pitch straight fin** design. This maximizes surface area for heat dissipation while maintaining a low profile (10mm height), making it ideal for tight enclosures. * **Material:** Extruded aluminum (6063) provides a balance between high thermal conductivity and structural rigidity. #### B. pushPIN™ Attachment System Instead of using messy adhesives or bulky screws, this part uses a standardized push-pin mechanism. * **Components:** Plastic pins and stainless steel springs. * **Function:** Ensures consistent pressure (clamping force) across the interface, which is critical for maximizing heat transfer from the chip to the metal. #### C. Thermal Interface Material (TIM) * **Part Type:** T766. * **Function:** A phase-change or high-conductivity pad pre-applied to the base. It fills microscopic air gaps between the electronic chip and the heat sink base to lower thermal resistance. #### D. Blue Anodized Coating * **Function:** Beyond aesthetics, the anodized layer provides electrical insulation (to prevent short circuits if it touches surrounding components) and increases corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM) within the electronic chassis: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.78 | | 300 | 1.5 | 4.42 | | 500 | 2.5 | 3.27 | | 700 | 3.5 | 2.72 | ---