The **ATS-05D-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-PIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Dimensions (L x W)** | 60 mm x 60 mm | | **Height** | 12 mm | | **Thermal Resistance** | 6.39 °C/W (at 100 LFM) | | **Fin Pattern** | XC-CUT (Cross-Cut) | --- ## 2. Component Breakdown ### A. Material and Design * **Aluminum 6063:** This alloy is selected for its high thermal conductivity and structural integrity. * **XC-CUT Pattern:** The "XC" indicates a cross-cut fin design. Unlike straight fins, cross-cuts allow for multidirectional airflow, which is critical in compact electronic enclosures where air may not move in a single linear path. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases surface emissivity (improving radiant heat transfer) and provides corrosion resistance. ### B. The push-PIN™ Attachment System This specific model uses a hardware-based mounting system rather than thermal tape. 1. **Springs:** Provides consistent pressure (Pre-assembled with a compression spring). 2. **Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. 3. **Reliability:** This ensures the heat sink remains in contact with the chip even during mechanical shock or vibration. ### C. Thermal Performance Data Thermal resistance measures how effectively the part moves heat away from the silicon. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.39 | | 300 (1.5 m/s) | 3.13 | | 500 (2.5 m/s) | 2.32 | --- ## 3. Application Use Cases The **ATS-05D-207-C2-R0** is typically found in: * **Telecommunications:** Cooling signal processing units. * **Industrial PCs:** Where low-profile (12mm) cooling is required. * **Embedded Systems:** For mounting on square-package chips (BGA/LGA). ---