ATS-05D-26-C2-R0
AI

The **ATS-05D-26-C2-R0** is a specific electronic cooling component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** Heat Sink series, designed for high-performance cooling of electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
|:---|:---|
| **Part Number** | ATS-05D-26-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Push-pin and Spring) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 10mm |
| **Fin Pattern** | Square Fin (Fine pitch) |
| **Thermal Resistance** | 14.20 °C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (High performance) |
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### 2. Design and Components
This part is not an active electronic circuit but a **passive thermal management component**. Its "electronic" relevance lies in its ability to prevent thermal throttling or hardware failure in semiconductors.
* **Heat Sink Base:** Flat aluminum surface that makes direct contact with the electronic chip.
* **Fin Array:** The square fin design increases the surface area, allowing heat to dissipate into the surrounding air more efficiently.
* **Push-Pin Mechanism:** Uses brass or plastic pins with compression springs. This ensures even pressure across the chip, which is critical for maximizing heat transfer.
* **Thermal Interface Material (TIM):** Pre-applied T766 phase-change material or grease on the base. This fills microscopic air gaps between the chip and the metal.
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### 3. Key Electronic Applications
This specific model is often used in the following scenarios:
1. **Network Switches/Routers:** Cooling high-speed processing chips.
2. **Embedded Systems:** For industrial PCs where vertical space is limited (low 10mm profile).
3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
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### 4. Thermal Performance Comparison
The effectiveness of the ATS-05D-26-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
|:---:|:---:|:---:|
| 100 | 0.5 | 14.20 |
| 300 | 1.5 | 3.12 |
| 500 | 2.5 | 1.47 |
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- ⤷What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How does the push-pin mounting system compare to adhesive thermal tape?
- ⤷ Can this heat sink be used on a standard Raspberry Pi or similar SBC?