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  • ATS-05D-26-C2-R0

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    The **ATS-05D-26-C2-R0** is a specific electronic cooling component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** Heat Sink series, designed for high-performance cooling of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | |:---|:---| | **Part Number** | ATS-05D-26-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Push-pin and Spring) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Fin Pattern** | Square Fin (Fine pitch) | | **Thermal Resistance** | 14.20 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Design and Components This part is not an active electronic circuit but a **passive thermal management component**. Its "electronic" relevance lies in its ability to prevent thermal throttling or hardware failure in semiconductors. * **Heat Sink Base:** Flat aluminum surface that makes direct contact with the electronic chip. * **Fin Array:** The square fin design increases the surface area, allowing heat to dissipate into the surrounding air more efficiently. * **Push-Pin Mechanism:** Uses brass or plastic pins with compression springs. This ensures even pressure across the chip, which is critical for maximizing heat transfer. * **Thermal Interface Material (TIM):** Pre-applied T766 phase-change material or grease on the base. This fills microscopic air gaps between the chip and the metal. --- ### 3. Key Electronic Applications This specific model is often used in the following scenarios: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PCs where vertical space is limited (low 10mm profile). 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-05D-26-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | |:---:|:---:|:---:| | 100 | 0.5 | 14.20 | | 300 | 1.5 | 3.12 | | 500 | 2.5 | 1.47 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How does the push-pin mounting system compare to adhesive thermal tape?
    • ⤷ Can this heat sink be used on a standard Raspberry Pi or similar SBC?