The **ATS-05D-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 6.35mm | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Straight Fin | | **ROHS Status** | Compliant | --- ### 2. Key Components & Design #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™ system**. This involves: * **Brass/Plastic Pins:** Used to secure the sink through pre-drilled holes in the PCB. * **Compression Springs:** Provides consistent pressure to ensure maximum contact between the heat sink base and the component, optimizing thermal transfer. #### B. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied. * **Function:** It fills microscopic air gaps between the component surface and the aluminum base. * **Performance:** High thermal conductivity to ensure heat moves efficiently into the fins. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling**. Because the height is relatively low (6.35mm), it is ideal for low-profile applications or enclosures where vertical space is limited. --- ### 3. Applications This part is commonly found in the following electronic systems: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Computing:** Compact industrial PCs. 3. **Power Electronics:** Cooling MOSFETs or voltage regulator modules (VRMs). --- ### 4. Comparison of Airflow Performance Thermal resistance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 25.25 | | 300 (1.5 m/s) | 8.82 | | 500 (2.5 m/s) | 5.94 | ---