The **ATS-05D-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips. --- ## 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 0.95°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Dimension (L x W x H)** | 40.00mm x 40.00mm x 17.50mm | | **Fin Style** | Spread Fin (Optimized for airflow) | | **Spring Type** | Compression Spring (Steel) | --- ## 2. Electronic Component Breakdown ### A. The Heat Sink Body The core component is an aluminum extrusion. In electronics, the efficiency of this part is measured by its **Thermal Resistance ($\theta$)**. A lower value (in this case, reaching 0.95°C/W) means the part is highly effective at moving heat away from the semiconductor junction to the ambient air. ### B. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of **Thermal Interface Material** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip (e.g., a CPU or FPGA) to ensure maximum heat transfer. * **Material:** Usually a high-performance phase-change or grease-like compound. ### C. The pushPIN™ Attachment System Unlike adhesive tapes which can fail under high heat, this part uses a mechanical **pushPIN™** system. * **Electronic Safety:** Ensures a specific, consistent pressure (clamping force) is applied to the chip. This prevents "cracking" the die while maintaining enough contact to prevent overheating. * **Grounding:** The mechanical connection can sometimes assist in EMI shielding or grounding strategies depending on the PCB layout. --- ## 3. Airflow Performance Data The electronic cooling efficiency changes based on the air velocity (measured in Linear Feet per Minute - LFM) provided by system fans. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 1.80 | | 200 | 0.95 | | 300 | 0.70 | | 400 | 0.60 | --- ## 4. Typical Applications This part is commonly used to cool high-power integrated circuits in: * **Networking Hardware:** Switches and Routers. * **Industrial PCs:** High-reliability embedded systems. * **Power Supplies:** Cooling MOSFETs or power regulators. ---