The **ATS-05D-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to optimize airflow and maximize surface area for heat dissipation. --- ### 1. Technical Specifications The part is defined by its physical dimensions, material composition, and thermal resistance capabilities. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design The "68" series features a unique tapered fin structure. Unlike standard square fin heat sinks, this design reduces pressure drop and increases the effectiveness of convective cooling by channeling air more efficiently through the fins. #### B. pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical **pushPIN™** system. * **Spring-loaded:** Ensures constant, uniform pressure on the electronic component (CPU, GPU, or MOSFET). * **Reliability:** Provides better shock and vibration resistance compared to clip-on alternatives. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the chip, ensuring maximum heat transfer. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 15.31 | | **200** | 5.84 | | **300** | 4.06 | | **400** | 3.20 | --- ### 4. Applications * **Integrated Circuits (ICs):** Cooling BGA and PBGA packages. * **Telecommunications:** Used in base stations and networking switches. * **Power Supplies:** Cooling high-heat voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but heat output is high.