The **ATS-05D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | 1.47 °C/W (at 100 LFM) | | **Hole Pattern** | Square | | **Pitch** | 1.27mm | --- ### 2. Part Number Breakdown The part number follows a specific nomenclature used by ATS to identify the configuration: * **ATS-05**: Series designation (pushPIN™ Thermal Management). * **D**: Thermal resistance characteristic/Fin density category. * **75**: Dimensions/Form factor code. * **C1**: Thermal Interface Material (TIM) and finish code (typically indicates Aluminum with Blue Anodized finish). * **R0**: Revision or specific packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not contain circuits), it is critical for the electronic health of a system: 1. **Thermal Dissipation:** It increases the surface area of a high-heat component (like a CPU, FPGA, or MOSFET) to dissipate heat into the surrounding air via convection. 2. **Junction Temperature Control:** By maintaining a low thermal resistance, it keeps the semiconductor die within its safe operating temperature range, preventing thermal throttling or permanent damage. 3. **Mechanical Stability:** The "pushPIN™" system uses a brass component and a stainless steel spring to provide consistent pressure on the chip, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 4. Application Example This part is commonly used in networking hardware, industrial computers, and power electronics where vertical space allows for a 30mm height profile. ```yaml Component_Type: Passive Cooling Mounting_Style: Through-hole (Pins) Target_Devices: - BGA (Ball Grid Array) - QFP (Quad Flat Package) - Power Transistors ```