The **ATS-05D-79-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core technical specifications for this unit: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.63 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 11.77 °C/W (Natural Convection) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Straight (High Density) | --- ### 2. Component Breakdown The ATS-05D-79-C3-R0 is engineered for maximum heat dissipation in tight spaces. Its design features can be broken down into three main categories: #### A. Thermal Performance * **Fin Density:** The "Straight" fin pattern provides a large surface area for heat to transfer from the component to the ambient air. * **Phase Change Material (PCM):** This specific model typically comes with **T412** thermal interface material pre-applied to the base, ensuring minimal air gaps between the chip and the heat sink. #### B. Mechanical Attachment (pushPIN™) The "pushPIN™" system is a mounting mechanism that replaces traditional adhesive tapes. It consists of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Stainless Steel Springs:** Provide precise pressure (compression) to ensure optimal thermal contact. #### C. Environmental Resistance * **Blue Anodized Coating:** The blue finish isn't just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant cooling. --- ### 3. Applications This specific heat sink is commonly used in: * **Telecommunications:** Cooling high-speed processors in routers or switches. * **Industrial PCs:** Maintaining stability in high-temperature environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.